FREESCALE SEMICONDUCTOR M52210DEMO — демо плата

Предназначена для разработки и тестирования систем на базе микроконтроллеров семейства Coldfire. Совместима с множеством моделей микропроцессоров от FREESCALE.

Технические характеристики

Совместимость

• MC68360AI25VL
• MC68EC030FE40C
• MC68030FE33C
• MC68030FE20C
• MC68340FE25E

Применение

Данная демо плата широко используется для разработки и тестирования встраиваемых систем, научных проектов, а также в образовательных учреждениях для изучения принципов работы микроконтроллеров. Она обеспечит надежность и высокую производительность в различных приложениях.

Преимущества

• Высокая производительность с частотой 25 МГц
• Совместимость с многофункциональными микроконтроллерами
• MTBF(среднее время наработки на отказ) — более 10000 часов
• OEM экономия за счет использования единого решения
• Наличие на складе, быстрая доставка по Казахстану

Совместимые и аналогичные артикулы

Также ищут по артикулам: MC68360AI25VL IC, 32BIT MCU, COLDFIRE, 25MHZ, FQFP-240, CONTROLLER FAMILY/SERIES:68K, CORE SIZE:32BIT, NO. OF I/OS:3, SUPPLY VOLTAGE RANGE:3V TO 3.6V, 4.75V TO 5.2, DEMOACKIT FLEXIS AC, E-FIELD SENSOR, USB BDM, DEMO KIT, SILICON MANUFACTURER:FREESCALE, CORE ARCHITECTURE:COLDFIRE, HCS08, CORE SUB-ARCHITECTURE:COLDFIRE V1, HC, DEMOJM MCF51JM, S08JM, CAN TXRX, ON CHIP USB, DEMO BOARD, SILICON MANUFACTURER:FREESCALE, CORE ARCHITECTURE:COLDFIRE, HCS08, CORE SUB-ARCHITECTURE:COLDFIRE V, DEMOQE128 QE128 FLEXIS, LOGIC ANALYZER, ACCEL, DEMO BOARD, SILICON MANUFACTURER:FREESCALE, CORE ARCHITECTURE:COLDFIRE, HCS08, CORE SUB-ARCHITECTURE:COLDFIRE V1,, KITMPR083EVM 8-POSITION ROTARY MPR083 EVALUATION BOARD, SILICON MANUFACTURER:FREESCALE, SILICON CORE NUMBER:MPR083, KIT APPLICATION TYPE:SENSING - TOUCH / PROXIMIT, M5211DEMO MCF521X, COLDFIRE, EDGE/INTERRUPT PORT, DEMO BOARD, SILICON MANUFACTURER:FREESCALE, CORE ARCHITECTURE:COLDFIRE, CORE SUB-ARCHITECTURE:COLDFIRE V2, SIL, M52233DEMO MCF5223X, BDM/JTAG PORTS, DMA CONTROL, DEMO BOARD, SILICON MANUFACTURER:FREESCALE, CORE ARCHITECTURE:COLDFIRE, CORE SUB-ARCHITECTURE:COLDFIRE V2, SILI, M68TB05B32B56 MIN QTY 4 TOOLSDEVELOPMENT KIT, FOR USE WITH:68HC05B6/B8/B16/B3268HC705B16N/B32 ROHS COMPLIANT: NA, KIT33886DHEVB TOOLS DEVELOPMENT KIT, SUPPORTED DEVICES:MC33886, FOR USE WITH:MC33886, LEADED PROCESS COMPATIBLE:NO, PEAK REFLOW COMPATIBLE (260 C):NO ROHS COMPLIANT, KIT34712EPEVBE EVALUATION KIT, SILICON MANUFACTURER:FREESCALE, SILICON CORE NUMBER:MC34712, KIT APPLICATION TYPE:POWER MANAGEMENT, APPLICATION SUB TYPE:DDR SMPS, KIT, KITMC33941EVM EVALUATION KIT FOR THE MC33941 IN TOUCH SENSING APPLICATIONS, DEVELOPMENT TOOL TYPE:HARDWARE - EVAL/DEMO BOARD, SUPPORTED DEVICES:MC33941MC33940, TOOL, DEMO9S08QE32 MC9S08QE32 DEMONSTRATION BOARD, DEVELOPMENT TOOL TYPE:HARDWARE / SOFTWARE - EVAL/DEMO BOARD, SUPPORTED FAMILIES:S08QE, SUPPORTED DEVICES:MC9S08QE32, T, DEMO9S08AC60E MC9S08AC60 DEMONSTRATION BOARD, SILICON MANUFACTURER:FREESCALE, CORE ARCHITECTURE:HCS08, CORE SUB-ARCHITECTURE:HCS08, SILICON CORE NUMBER:MC9S08, SILI, DEMO9S08AW60E MC9S08AW60, USB TO BDM INTERFACE, DEMO BOARD, SILICON MANUFACTURER:FREESCALE, CORE ARCHITECTURE:HCS08, CORE SUB-ARCHITECTURE:HCS08, SILICON CORE NUMBE, LFEBS12UB HARDWARE / SOFTWARE - STARTER KIT, SILICON MANUFACTURER:FREESCALE, CORE ARCHITECTURE:S12, CORE SUB-ARCHITECTURE:S12, SILICON CORE NUMBER:MC9S12, SILIC, MC68882EI33A MIN QTY 18 SPECIAL FUNCTION IC, NO. OF BITS:32, SUPPLY VOLTAGE MAX:7V, TERMINATION:SMD, PACKAGE/CASE:68-PLCC, NO. OF PINS:68, CLOCK SPEED:33MHZ, LEADE, MC68360AI25L IC, 32BIT MCU, COLDFIRE, 25MHZ, FQFP-240, CONTROLLER FAMILY/SERIES:68K, CORE SIZE:32BIT, NO. OF I/OS:3, SUPPLY VOLTAGE RANGE:3V TO 3.6V, 4.75V TO 5.2, MC68EC030FE40C ENHANCED 32-BIT PROCESSOR, SERIES:68K/COLDFIRE, NO. OF BITS:32, FREQUENCY TYP:50MHZ, CACHE MEMORY ON CHIP L1/L2:512BYTE, SUPPLY VOLTAGE MIN:-0.3V, SUP, MC68030FE33C MICROPROCESSOR IC, SERIES:68K/COLDFIRE, PACKAGE/CASE:ADVANCED PLASTIC PGA, CLOCK SPEED:33MHZ, LEADED PROCESS COMPATIBLE:YES, PEAK REFLOW COMPATIBLE (2, DEMO908QB8 MC908QB8 DEMONSTRATION BOARD, DEVELOPMENT TOOL TYPE:HARDWARE - EVAL/DEMO BOARD, SUPPORTED DEVICES:MC908QB4 MC908QB8 MC908QY8, TOOL/BOARD APPLICATION:G, MC68030FE20C MIN QTY 180 MICROPROCESSOR IC, SERIES:68K/COLDFIRE, PACKAGE/CASE:ADVANCED PLASTIC PGA, CLOCK SPEED:20MHZ, LEADED PROCESS COMPATIBLE:YES, PEAK REFLOW C, MC68EN360VR25VL PRICE/EA (MIN PURCH= 44) - 32-BIT EMBEDDED MICROPROCESSOR, SERIES:68K - M680X0, CORE SIZE:32 BIT, CPU SPEED:25MHZ, DIGITAL IC CASE STYLE:BGA, NO. OF P, 1320XRFC 1320XRF DAUGHTER CARD, SILICON MANUFACTURER:FREESCALE, KIT APPLICATION TYPE:COMMUNICATION NETWORKING, APPLICATION SUB TYPE:ZIGBEE, SILICON FAMILY NA, DEMO9S08JM16 MC9S08JM16, BUILT-IN USB BDM, USB 2.0, DEMO BOARD, SILICON MANUFACTURER:FREESCALE, CORE ARCHITECTURE:HCS08, CORE SUB-ARCHITECTURE:HCS08, SILICON CORE, LFBGARBU1AO , DEVELOPMENT TOOL TYPE:HARDWARE - EVAL/DEMO BOARD, TOOL/BOARD APPLICATION:GENERAL PURPOSE MCUMPU DSP DSC ROHS COMPLIANT: YES, MC68882EI25A MIN QTY 18 SPECIAL FUNCTION IC, NO. OF BITS:32, SUPPLY VOLTAGE MAX:7V, TERMINATION:SMD, PACKAGE/CASE:68-PLCC, NO. OF PINS:68, CLOCK SPEED:25MHZ, LEADE, MC68HC000RC10 MIN QTY 21 MICROPROCESSOR IC, SUPPLY VOLTAGE MAX:5V, PACKAGE/CASE:68-PGA, NO. OF PINS:68, CLOCK SPEED:10MHZ, LEADED PROCESS COMPATIBLE:YES, MIPS:2, PR, DEMO9S08DZ60 MC9S08DZ60, USB TO BDM INTERFACE, DEMO BOARD, SILICON MANUFACTURER:FREESCALE, CORE ARCHITECTURE:HCS08, CORE SUB-ARCHITECTURE:HCS08, SILICON CORE NUMBE, MC68340FE25E IC, 32BIT MPU, 25MHZ, QFP-144, SERIES:68K - M683XX, CORE SIZE:32BIT, PROGRAM MEMORY SIZE:-, SUPPLY VOLTAGE RANGE:4.75V TO 5.25V, DIGITAL IC CASE STYLE