EMULATION H270305900005A HEAT SINK, PACKAGES COOLED:BGA, THERMAL RESISTANCE:15.5C/W, EXTERNAL HEIGHT - METRIC:7.62MM, PEAK REFLOW COMPATIBLE (260 C):YES, HEIGHT:7.62MM, LEADED H270305900005A HEAT SINK, PACKAGES COOLED:BGA, THERMAL RESISTANCE:15.5C/W, EXTERNAL HEIGHT - METRIC:7.62MM, PEAK REFLOW COMPATIBLE (260 C):YES, HEIGHT:7.62MM, LEADED

Теплоотвод EMULATION H270305900005A. Параметры: термическое сопротивление 15.5 °C/W, высота 7.62 мм, совместимость с BGA. Подходит для систем с высокими требованиями к теплоотведению.
АртикулH270305900005A HEAT SINK, PACKAGES COOLED:BGA, THERMAL RESISTANCE:15.5C/W, EXTERNAL HEIGHT - METRIC:7.62MM, PEAK REFLOW COMPATIBLE (260 C):YES, HEIGHT:7.62MM, LEADED
Empty photo

Обзор

EMULATION H270305900005A — Теплоотвод

Теплоотвод EMULATION предназначен для эффективного охлаждения компонентов BGA. Он совместим с различными BGA-пакетами, обеспечивая надежное удаление тепла и защиту от перегревов.

Технические характеристики

ПараметрЗначение
ТипТеплоотвод
БрендEMULATION
АртикулH270305900005A
Термическое сопротивление15.5 °C/W
Внешняя высота7.62 mm
Совместимость с пиковым переплавлением (260 °C)Да
Высота7.62 mm
ЛидированноеДа

Совместимость

  • BGA-пакеты
  • FP-XX-XX
  • ST-XXXX
  • другие аналогичные компоненты
  • не ограничивается одной моделью

Применение

Теплоотвод EMULATION H270305900005A предназначен для улучшения теплоотведения в устройствам BGA. Он эффективно справляется с высокой тепловой нагрузкой, что делает его незаменимым в сборках с элементами, требующими оптимального охлаждения для стабильной работы.

Преимущества

  • Термическое сопротивление 15.5 °C/W
  • Совместим с множеством BGA-пакетов
  • Долговечность и надежность
  • Экономия на OEM-решениях
  • Доступность для заказа и быстрая доставка по РК

Совместимые и аналогичные артикулы

АртикулБрендТип
FP-T23-04 MICROCLIP FOR 0402 COMPONENTSEMULATIONСовместимый артикул
290N-SUN CHIP PULLEREMULATIONСовместимый артикул
ST3042BG16X198 BGA REWORK STENCIL, WIDTH:25MM, PEAK REFLOW COMPATIBLE (260 C):YES, LENGTH:21MM, BODY MATERIAL:ANTI-STATIC POLYMER FILM, THICKNESS:0.203MM, SERIES:FLEEMULATIONСовместимый артикул
ST3243BG0224 BGA REWORK STENCIL, WIDTH:23MM, PEAK REFLOW COMPATIBLE (260 C):YES, LENGTH:23MM, BODY MATERIAL:ANTI-STATIC POLYMER FILM, THICKNESS:0.102MM, SERIES:FLEEMULATIONСовместимый артикул
ST3522BG0266 BGA REWORK STENCIL, WIDTH:35MM, PEAK REFLOW COMPATIBLE (260 C):YES, LENGTH:35MM, BODY MATERIAL:ANTI-STATIC POLYMER FILM, THICKNESS:0.152MM, SERIES:FLEEMULATIONСовместимый артикул
ST2082BG0174 BGA REWORK STENCIL, WIDTH:23MM, PEAK REFLOW COMPATIBLE (260 C):YES, LENGTH:23MM, BODY MATERIAL:ANTI-STATIC POLYMER FILM, THICKNESS:0.152MM, SERIES:FLEEMULATIONСовместимый артикул
ST1963BG0144 BGA REWORK STENCIL, WIDTH:15MM, PEAK REFLOW COMPATIBLE (260 C):YES, LENGTH:15MM, BODY MATERIAL:ANTI-STATIC POLYMER FILM, THICKNESS:0.102MM, SERIES:FLEEMULATIONСовместимый артикул
ST2563BG0164 BGA REWORK STENCIL, WIDTH:17MM, PEAK REFLOW COMPATIBLE (260 C):YES, LENGTH:17MM, BODY MATERIAL:ANTI-STATIC POLYMER FILM, THICKNESS:0.102MM, SERIES:FLEEMULATIONСовместимый артикул
ST2562BG0168 BGA REWORK STENCIL, WIDTH:21MM, PEAK REFLOW COMPATIBLE (260 C):YES, LENGTH:21MM, BODY MATERIAL:ANTI-STATIC POLYMER FILM, THICKNESS:0.203MM, SERIES:FLEEMULATIONСовместимый артикул
CQ08E SMD REMOVAL ALLOY, WIRE, CLEANER APPLICATIONS:PCBS, SERIES:CHIPQUIK, LEADED PROCESS COMPATIBLE:NO, PEAK REFLOW COMPATIBLE (260 C):NO, ROHS COMPLIANT:EMULATIONСовместимый артикул
AS-08-08-01S-3 IC ADAPTER, 8-SOIC TO 8-DIP, CONVERT FROM:8-SOIC, CONVERT TO:8-DIP, PITCH SPACING:2.54MM, ROW PITCH:7.62MM, CONNECTOR TYPE:SOCKET ADAPTER, LEADED PROCEMULATIONСовместимый артикул
S-SSO-00-024-C S-SSO-00-024-C,BI SKT (24-SS03).173IN BDY .65MMPTCEMULATIONСовместимый артикул
FOP1 CONNECTOR ASSEMBLIES, TEST LEADS TELEPHONE CABLES, FOR USE WITH:SMT PACKAGES DOWN TO 0.2MM TO 0.3MM LEAD PITCH, LEADED PROCESS COMPATIBLE:NO, PEAK REFEMULATIONСовместимый артикул
AB-044-SO09S-A-M IC ADAPTER, 44-SOIC TO 44-DIP, CONVERT FROM:44-SOIC, CONVERT TO:44-DIP, PITCH SPACING:1.27MM, ROW PITCH:15.24MM, SOCKET MOUNTING:PC BOARD, CONNECTOR TEMULATIONСовместимый артикул
FP-1B30 IC SOCKET TEST CLIP, ACCESSORY TYPE:GRIPPER, FOR USE WITH:LOGIC ANALYZER AND OSCILLOSCOPES, LEADED PROCESS COMPATIBLE:YES, NO. OF CONTACTS:1, PEAK REFEMULATIONСовместимый артикул
CQ08ENL , LENGTH:4FT, APPROVAL CATEGORIES:REMOVAL ALLOY, NO LEAD, FOR USE WITH:DESOLDERINGEMULATIONСовместимый артикул
AB-020-ST03S-A.3-W ADAPTER, 20 PIN SSOP, 0.65MM PITCH,EMULATIONСовместимый артикул
AB020ST03SAW.3 AB020ST03SAW.3EMULATIONСовместимый артикул
CQ291E FLUX REMOVER, SYRINGE, CLEANER TYPE:FLUX REMOVER, DISPENSING METHOD:SYRINGE, SERIES:CHIPQUIK, VOLUME:10CC, LEADED PROCESS COMPATIBLE:NO, PEAK REFLOW CEMULATIONСовместимый артикул
AB-028-SS01S-A-M IC ADAPTER, 28-SSOP TO 28-DIP, CONVERT FROM:28-SSOP, CONVERT TO:28-DIP, PITCH SPACING:2.54MM, ROW PITCH:15.24MM, CONNECTOR TYPE:SOCKET ADAPTER, CONVEREMULATIONСовместимый артикул
CQ123ENL CHIP QUICK SMD REMOVAL KIT, KIT CONTENTS:2.5FT LEAD FREE REMOVAL ALLOY, 1CC NO CLEAN TACK FLUX, 4 ALCOHOL PADSEMULATIONСовместимый артикул
FP-1B10 IC SOCKET TEST CLIP, ACCESSORY TYPE:GRIPPER, FOR USE WITH:LOGIC ANALYZER AND OSCILLOSCOPES, LEADED PROCESS COMPATIBLE:YES, NO. OF CONTACTS:1, PEAK REFEMULATIONСовместимый артикул
CQ123E SMD REMOVAL KIT, WIRE, CLEANER APPLICATIONS:PCBS, LEADED PROCESS COMPATIBLE:NO, PEAK REFLOW COMPATIBLE (260 C):NO, ROHS COMPLIANT: NOEMULATIONСовместимый артикул
BC4-44-SPACER-G SOCKET ADAPTER, 44POS, THROUGH HOLE, CONVERT FROM:44-PLCC, CONVERT TO:44-PLCC, PITCH SPACING:1.27MM, SOCKET MOUNTING:PC BOARD, CONNECTOR TYPE:SOCKET AEMULATIONСовместимый артикул
BC4-32-SPACER-G SOCKET ADAPTER, 32POS, THROUGH HOLE, CONVERT FROM:32-PLCC, CONVERT TO:32-PLCC, PITCH SPACING:1.27MM, SOCKET MOUNTING:PC BOARD, CONNECTOR TYPE:SOCKET AEMULATIONСовместимый артикул
AB-020-ST03S-A-M IC ADAPTER, 20-TSSOP TO 20-DIP, CONVERT FROM:20-TSSOP, CONVERT TO:20-DIP, PITCH SPACING:2.54MM, ROW PITCH:15.24MM, CONNECTOR TYPE:SOCKET ADAPTER, LEADEMULATIONСовместимый артикул
CQ291ENL FLUX, SYRINGE, 10CC, FLUX TYPE:NO CLEAN, SERIES:CHIPQUIK, FLUX APPLICATIONS:SOLDERING, DISPENSING METHOD:SYRINGE, VOLUME:10CCEMULATIONСовместимый артикул
AB-020-ST35S-A-M IC ADAPTER, 20-TSSOP TO 20-DIP, CONVERT FROM:20-TSSOP, CONVERT TO:20-DIP, PITCH SPACING:2.54MM, ROW PITCH:15.24MM, CONNECTOR TYPE:SOCKET ADAPTER, CONVEMULATIONСовместимый артикул
S-TSO-SM-048-B TSOP SOCKET, 48POS, SMD, CONNECTOR TYPE:TSOP SOCKET, SERIES:-, NO. OF CONTACTS:48, PITCH SPACING:0.5MM, ROW PITCH:18.4MM, CONTACT TERMINATION:SURFACEEMULATIONСовместимый артикул
POGO-PIN-19.0-1 POGO PIN 19.05MM OVERALL LENGTH, 0.91MM BARREL DIAMETER, DOUBLE ENDED RADIUS PLUNGERSEMULATIONСовместимый артикул
POGO-PIN-17.5-1 POGO PIN 17.5MM LENGTH, 0.51MM BARREL DIAMETER, SINGLE ENDED RADIUS PLUNGER,39 GRAMS OF SPRING FORCE AT 2/3 TRAVELEMULATIONСовместимый артикул
HEADERMALE32 BOARD-BOARD CONN, HEADER, 32WAY, 1ROW, PITCH SPACING:2.54MM, NO. OF ROWS:1, NO. OF CONTACTS:32, GENDER:HEADER, CONTACT TERMINATION:THROUGH HOLE VERTICEMULATIONСовместимый артикул
POGOPIN1301 TEST POINT, PCB, CONNECTOR TYPE:TEST POINT, CONNECTOR TIP STYLE:POINT, CURRENT RATING:5A, OVERALL LENGTH:13MM, SPRING FORCE INITIAL:1OZ, SPRING FORCEEMULATIONСовместимый артикул
POGO-REC-17.5-1 POGO-REC-17.5-1CONNECTOREMULATIONСовместимый артикул
FOP-3 CONNECTOR ASSEMBLIES, TEST LEADS TELEPHONE CABLES, FOR USE WITH:SMT PACKAGES UP TO 0.5MM LEAD PITCH WITH LOGIC ANALYZER OR OSCILLOSCOPES, LEADED PROCEEMULATIONСовместимый артикул
FOP-4 CONNECTOR ASSEMBLIES, TEST LEADS TELEPHONE CABLES, FOR USE WITH:SMT PACKAGES UP TO 0.5MM LEAD PITCH WITH LOGIC ANALYZER OR OSCILLOSCOPES, LEADED PROCEEMULATIONСовместимый артикул
WWPOST-40-PGA PCB, PROTOTYPING BOARD, NO. OF CONTACTS:1, GENDER:PIN, CONTACT TERMINATION:THROUGH HOLE VERTICAL, CONNECTOR TYPE:WIRE STRIP, PEAK REFLOW COMPATIBLE (2EMULATIONСовместимый артикул
FP-T23-08 (PRICE/EA) MICROCLIP FOR 0805 COMPONENTSEMULATIONСовместимый артикул
MIC-38-CABLE-MM-18 (PRICE/EACH), 38 PIN MICTOR CABLE, MALE TO MALEEMULATIONСовместимый артикул
MIC-38-CABLE-MM-24 38 PIN MICTOR CABLE, MALE TO MALE, 24 INCHES LONGEMULATIONСовместимый артикул
ET-5403A PRO SERIES SOFT TOUCH RETENTION MODULEEMULATIONСовместимый артикул
BCM-076-MICTOR-0000 PROBE ADAPTEREMULATIONСовместимый артикул
MIC-38-CABLE-MF-18 MICTOR 38 CABLE, MALE TO FEMALE, 18 INCHES LONGEMULATIONСовместимый артикул
MIC-38-CABLE-MF-24 MICTOR 38 CABLE, MALE TO FEMALE, 24 INCHES LONG PER DRAWINGEMULATIONСовместимый артикул
MIC38-CABLE-MM-12 38 PIN MICTOR CABLE, MALE TO MALE, 12 INCHES LONG"EMULATIONСовместимый артикул

Также ищут по артикулам: FP-T23-04 MICROCLIP FOR 0402 COMPONENTS, 290N-SUN CHIP PULLER, ST3042BG16X198 BGA REWORK STENCIL, WIDTH:25MM, PEAK REFLOW COMPATIBLE (260 C):YES, LENGTH:21MM, BODY MATERIAL:ANTI-STATIC POLYMER FILM, THICKNESS:0.203MM, SERIES:FLE, ST3243BG0224 BGA REWORK STENCIL, WIDTH:23MM, PEAK REFLOW COMPATIBLE (260 C):YES, LENGTH:23MM, BODY MATERIAL:ANTI-STATIC POLYMER FILM, THICKNESS:0.102MM, SERIES:FLE, ST3522BG0266 BGA REWORK STENCIL, WIDTH:35MM, PEAK REFLOW COMPATIBLE (260 C):YES, LENGTH:35MM, BODY MATERIAL:ANTI-STATIC POLYMER FILM, THICKNESS:0.152MM, SERIES:FLE, ST2082BG0174 BGA REWORK STENCIL, WIDTH:23MM, PEAK REFLOW COMPATIBLE (260 C):YES, LENGTH:23MM, BODY MATERIAL:ANTI-STATIC POLYMER FILM, THICKNESS:0.152MM, SERIES:FLE, ST1963BG0144 BGA REWORK STENCIL, WIDTH:15MM, PEAK REFLOW COMPATIBLE (260 C):YES, LENGTH:15MM, BODY MATERIAL:ANTI-STATIC POLYMER FILM, THICKNESS:0.102MM, SERIES:FLE, ST2563BG0164 BGA REWORK STENCIL, WIDTH:17MM, PEAK REFLOW COMPATIBLE (260 C):YES, LENGTH:17MM, BODY MATERIAL:ANTI-STATIC POLYMER FILM, THICKNESS:0.102MM, SERIES:FLE, ST2562BG0168 BGA REWORK STENCIL, WIDTH:21MM, PEAK REFLOW COMPATIBLE (260 C):YES, LENGTH:21MM, BODY MATERIAL:ANTI-STATIC POLYMER FILM, THICKNESS:0.203MM, SERIES:FLE, CQ08E SMD REMOVAL ALLOY, WIRE, CLEANER APPLICATIONS:PCBS, SERIES:CHIPQUIK, LEADED PROCESS COMPATIBLE:NO, PEAK REFLOW COMPATIBLE (260 C):NO, ROHS COMPLIANT:, AS-08-08-01S-3 IC ADAPTER, 8-SOIC TO 8-DIP, CONVERT FROM:8-SOIC, CONVERT TO:8-DIP, PITCH SPACING:2.54MM, ROW PITCH:7.62MM, CONNECTOR TYPE:SOCKET ADAPTER, LEADED PROC, S-SSO-00-024-C S-SSO-00-024-C,BI SKT (24-SS03).173IN BDY .65MMPTC, FOP1 CONNECTOR ASSEMBLIES, TEST LEADS TELEPHONE CABLES, FOR USE WITH:SMT PACKAGES DOWN TO 0.2MM TO 0.3MM LEAD PITCH, LEADED PROCESS COMPATIBLE:NO, PEAK REF, AB-044-SO09S-A-M IC ADAPTER, 44-SOIC TO 44-DIP, CONVERT FROM:44-SOIC, CONVERT TO:44-DIP, PITCH SPACING:1.27MM, ROW PITCH:15.24MM, SOCKET MOUNTING:PC BOARD, CONNECTOR T, FP-1B30 IC SOCKET TEST CLIP, ACCESSORY TYPE:GRIPPER, FOR USE WITH:LOGIC ANALYZER AND OSCILLOSCOPES, LEADED PROCESS COMPATIBLE:YES, NO. OF CONTACTS:1, PEAK REF, CQ08ENL , LENGTH:4FT, APPROVAL CATEGORIES:REMOVAL ALLOY, NO LEAD, FOR USE WITH:DESOLDERING, AB-020-ST03S-A.3-W ADAPTER, 20 PIN SSOP, 0.65MM PITCH,, AB020ST03SAW.3 AB020ST03SAW.3, CQ291E FLUX REMOVER, SYRINGE, CLEANER TYPE:FLUX REMOVER, DISPENSING METHOD:SYRINGE, SERIES:CHIPQUIK, VOLUME:10CC, LEADED PROCESS COMPATIBLE:NO, PEAK REFLOW C, AB-028-SS01S-A-M IC ADAPTER, 28-SSOP TO 28-DIP, CONVERT FROM:28-SSOP, CONVERT TO:28-DIP, PITCH SPACING:2.54MM, ROW PITCH:15.24MM, CONNECTOR TYPE:SOCKET ADAPTER, CONVER, CQ123ENL CHIP QUICK SMD REMOVAL KIT, KIT CONTENTS:2.5FT LEAD FREE REMOVAL ALLOY, 1CC NO CLEAN TACK FLUX, 4 ALCOHOL PADS, FP-1B10 IC SOCKET TEST CLIP, ACCESSORY TYPE:GRIPPER, FOR USE WITH:LOGIC ANALYZER AND OSCILLOSCOPES, LEADED PROCESS COMPATIBLE:YES, NO. OF CONTACTS:1, PEAK REF, CQ123E SMD REMOVAL KIT, WIRE, CLEANER APPLICATIONS:PCBS, LEADED PROCESS COMPATIBLE:NO, PEAK REFLOW COMPATIBLE (260 C):NO, ROHS COMPLIANT: NO, BC4-44-SPACER-G SOCKET ADAPTER, 44POS, THROUGH HOLE, CONVERT FROM:44-PLCC, CONVERT TO:44-PLCC, PITCH SPACING:1.27MM, SOCKET MOUNTING:PC BOARD, CONNECTOR TYPE:SOCKET A, BC4-32-SPACER-G SOCKET ADAPTER, 32POS, THROUGH HOLE, CONVERT FROM:32-PLCC, CONVERT TO:32-PLCC, PITCH SPACING:1.27MM, SOCKET MOUNTING:PC BOARD, CONNECTOR TYPE:SOCKET A, AB-020-ST03S-A-M IC ADAPTER, 20-TSSOP TO 20-DIP, CONVERT FROM:20-TSSOP, CONVERT TO:20-DIP, PITCH SPACING:2.54MM, ROW PITCH:15.24MM, CONNECTOR TYPE:SOCKET ADAPTER, LEAD, CQ291ENL FLUX, SYRINGE, 10CC, FLUX TYPE:NO CLEAN, SERIES:CHIPQUIK, FLUX APPLICATIONS:SOLDERING, DISPENSING METHOD:SYRINGE, VOLUME:10CC, AB-020-ST35S-A-M IC ADAPTER, 20-TSSOP TO 20-DIP, CONVERT FROM:20-TSSOP, CONVERT TO:20-DIP, PITCH SPACING:2.54MM, ROW PITCH:15.24MM, CONNECTOR TYPE:SOCKET ADAPTER, CONV, S-TSO-SM-048-B TSOP SOCKET, 48POS, SMD, CONNECTOR TYPE:TSOP SOCKET, SERIES:-, NO. OF CONTACTS:48, PITCH SPACING:0.5MM, ROW PITCH:18.4MM, CONTACT TERMINATION:SURFACE, POGO-PIN-19.0-1 POGO PIN 19.05MM OVERALL LENGTH, 0.91MM BARREL DIAMETER, DOUBLE ENDED RADIUS PLUNGERS, POGO-PIN-17.5-1 POGO PIN 17.5MM LENGTH, 0.51MM BARREL DIAMETER, SINGLE ENDED RADIUS PLUNGER,39 GRAMS OF SPRING FORCE AT 2/3 TRAVEL, HEADERMALE32 BOARD-BOARD CONN, HEADER, 32WAY, 1ROW, PITCH SPACING:2.54MM, NO. OF ROWS:1, NO. OF CONTACTS:32, GENDER:HEADER, CONTACT TERMINATION:THROUGH HOLE VERTIC, POGOPIN1301 TEST POINT, PCB, CONNECTOR TYPE:TEST POINT, CONNECTOR TIP STYLE:POINT, CURRENT RATING:5A, OVERALL LENGTH:13MM, SPRING FORCE INITIAL:1OZ, SPRING FORCE, POGO-REC-17.5-1 POGO-REC-17.5-1CONNECTOR, FOP-3 CONNECTOR ASSEMBLIES, TEST LEADS TELEPHONE CABLES, FOR USE WITH:SMT PACKAGES UP TO 0.5MM LEAD PITCH WITH LOGIC ANALYZER OR OSCILLOSCOPES, LEADED PROCE, FOP-4 CONNECTOR ASSEMBLIES, TEST LEADS TELEPHONE CABLES, FOR USE WITH:SMT PACKAGES UP TO 0.5MM LEAD PITCH WITH LOGIC ANALYZER OR OSCILLOSCOPES, LEADED PROCE, WWPOST-40-PGA PCB, PROTOTYPING BOARD, NO. OF CONTACTS:1, GENDER:PIN, CONTACT TERMINATION:THROUGH HOLE VERTICAL, CONNECTOR TYPE:WIRE STRIP, PEAK REFLOW COMPATIBLE (2, FP-T23-08 (PRICE/EA) MICROCLIP FOR 0805 COMPONENTS, MIC-38-CABLE-MM-18 (PRICE/EACH), 38 PIN MICTOR CABLE, MALE TO MALE, MIC-38-CABLE-MM-24 38 PIN MICTOR CABLE, MALE TO MALE, 24 INCHES LONG, ET-5403A PRO SERIES SOFT TOUCH RETENTION MODULE, BCM-076-MICTOR-0000 PROBE ADAPTER, MIC-38-CABLE-MF-18 MICTOR 38 CABLE, MALE TO FEMALE, 18 INCHES LONG, MIC-38-CABLE-MF-24 MICTOR 38 CABLE, MALE TO FEMALE, 24 INCHES LONG PER DRAWING, MIC38-CABLE-MM-12 38 PIN MICTOR CABLE, MALE TO MALE, 12 INCHES LONG"

Характеристики

Альтернативные артикули
FP-T23-04 MICROCLIP FOR 0402 C, 290N-SUN CHIP PULLER, ST3042BG16X198 BGA REWORK STEN, WIDTH 25MM, PEAK REFLOW COMPATIBLE 260 C Y, LENGTH 21MM, BODY MATERIAL ANTI-STATIC POLY, THICKNESS 0 203MM, SERIES FLE, ST3243BG0224 BGA REWORK STENCI, WIDTH 23MM, PEAK REFLOW COMPATIBLE 260 C Y, LENGTH 23MM, BODY MATERIAL ANTI-STATIC POLY, THICKNESS 0 102MM, SERIES FLE, ST3522BG0266 BGA REWORK STENCI, WIDTH 35MM, PEAK REFLOW COMPATIBLE 260 C Y, LENGTH 35MM, BODY MATERIAL ANTI-STATIC POLY, THICKNESS 0 152MM, SE
Бренд
EMULATION
Синонимы
теплоотвод, heat sink, BGA, системы охлаждения, thermal interface, aluminum heat sink, охлаждение чипов, passive cooling, thermal management, PCB cooling, чипы, IC, герметизация, soldering, soldering tools, температура, thermal resistance, адаптеры, решения для охлаждения, компоненты BGA, industrial cooling, electronics cooling, mounting solutions, OEM, для компонентов, теплопередача
13 T
H270305900005A HEAT SINK, PACKAGES COOLED:BGA, THERMAL RESISTANCE:15.5C/W, EXTERNAL HEIGHT - METRIC:7.62MM, PEAK REFLOW COMPATIBLE (260 C):YES, HEIGHT:7.62MM, LEADED
Новый склад: В наличии
Отзывы и оценки покупателей

Оставьте отзыв об этом товаре первым!